Název projektu:
Miniature refrigeration system for microelectronics (09 GB 44O7 3DZO)
Popis:
A London-based university has developed a miniature refrigeration system for improved cooling of microelectronics devices. The university is producing a prototype and is looking for partners to test and implement the device. On a longer term, the university is looking for partners to assist in ongoing miniaturisation of the refrigeration system.
Požadavky na partnera:
At present, computers mostly use heat sinks and fans to dissipate the heat generated by the main processor; however this technique is now reaching its limits. Vapour compression refrigeration systems are widely used for both domestic and industrial refrigeration, but to date they have not been applied on a small scale, mainly due to the difficulties associated with miniaturising some of the essential components of refrigeration systems.
The vapour compression refrigeration system developed by the university has sufficiently high heat transfer rate to allow steady cooling, while small enough to be incorporated into mainframe computers and data centres. The university is building a prototype of this device and is looking for partners to implement and further develop the miniature refrigeration system.
Innovative Aspects:
The ongoing development of computing power calls for increasing heat transfer from the processor, which conventional fans cannot achieve. This system offers a higher rate of heat transfer from a smaller device, removing cooling efficiency as a potential bottleneck for development of computing power.
The vapour compression refrigeration system developed by the university has sufficiently high heat transfer rate to allow steady cooling, while small enough to be incorporated into mainframe computers and data centres. The university is building a prototype of this device and is looking for partners to implement and further develop the miniature refrigeration system.
Innovative Aspects:
The ongoing development of computing power calls for increasing heat transfer from the processor, which conventional fans cannot achieve. This system offers a higher rate of heat transfer from a smaller device, removing cooling efficiency as a potential bottleneck for development of computing power.
Obchodní firma/fyzická osoba:
Technologické inovační centrum s.r.o.
Sídlo/Místo podnikání:
Kontaktní osoba:
Ing. Lenka Kostelníková Phd.
Email:
Telefon:
+420 739 570 792
