Název projektu:
Ultra-Smooth Planarization of Glass Substrate (11 LU 87GA 3NT3)
Popis:
A large US company is looking for proposals for planarizing local nano-scale bumps and divots on a flat SiO2-based glass substrate without increasing its surface roughness. Planarization methods can be either polishing or filling.
They are interested in joint/contract development, licensing.
The company's client manufactures and sells glass substrates with ultra smooth surfaces. Surface roughness at the nano-level is desired for various applications such as silicon wafers, glass substrates for HDD, and photomasks. New methods are being aggressively developed, not only in business but also in academia all over the world.
Therefore believing that useful technologies for solving this problem exist widely throughout the world, the client has issued this request for technology. The client anticipates obtaining technologies from organizations that already possess the required technology, or promising development proposals based on joint development or contract development.
Anticipated approaches include, but are not limited to, the following:
-Inorganic materials to coat and fill voids:
Materials: SiO2 transition metal oxide etc.
Coating methods: CVD, vapor deposition, sputtering etc.
-Reflow
Dry etching
Ion beam
Reactive ion etching
-Chemical etching
-New polishing methods different from CMP:
Float polishing
Use of functional fluids (ER fluids, MR fluids, etc.)
Technical Specifications / Specific technical requirements:
Description of the glass substrate
-Material: SiO2-based glass
-Size: = 6inch ? or = 6 inch square
-Surface roughness (measured by AFM, 1µm x 1µm) : Ra= 0.18 nm (equal to RMS = 0.15 nm)
-Description of bump and divot:
Locally exists on substrate surface (density: 0.1~10/cm²)
Shape: shallow oval
Size:
Length: = 500 nm
Height or depth: = 10 nm
Final requirements
-Surface roughness and smoothing of local bump/divot: reduce the height/depth of the local bump/divot to = 1nm without increasing the surface roughness (Ra= 0.18 nm). (The length of the bump/divot after planarization is not of concern).
-Area of planarization: global planarization of whole substrate surface is preferred
However the client has technology for detecting local bump/divot on the substrate before planarization, so local planarization is also acceptable to smooth out the bump/divot locally
-When adapting filling and coating methods, the coating material must have the following properties:
Heat resistance: = 200°C
Chemical resistance (acid, alkali, organic solvents): excellent
Stress: = 200MPa
Coating thickness: = 20nm
Reflectance: 10 to 20% at 200 to 500 nm is preferred. (Note: reflectance of the glass substrate is 5%).
Requirements of the respondents:
-At this stage, respondents should be able to reduce the height/depth of local bump/divot to = 50% of that prior to planarization
-The technology should be applicable not only for glass substrates but for similar materials such as silicon wafers
-Respondents should specifically demonstrate the current technology level (papers, research announcements, etc.)
-Proposals should describe a specific development plan for achieving the final requirements within three years.
They are interested in joint/contract development, licensing.
The company's client manufactures and sells glass substrates with ultra smooth surfaces. Surface roughness at the nano-level is desired for various applications such as silicon wafers, glass substrates for HDD, and photomasks. New methods are being aggressively developed, not only in business but also in academia all over the world.
Therefore believing that useful technologies for solving this problem exist widely throughout the world, the client has issued this request for technology. The client anticipates obtaining technologies from organizations that already possess the required technology, or promising development proposals based on joint development or contract development.
Anticipated approaches include, but are not limited to, the following:
-Inorganic materials to coat and fill voids:
Materials: SiO2 transition metal oxide etc.
Coating methods: CVD, vapor deposition, sputtering etc.
-Reflow
Dry etching
Ion beam
Reactive ion etching
-Chemical etching
-New polishing methods different from CMP:
Float polishing
Use of functional fluids (ER fluids, MR fluids, etc.)
Technical Specifications / Specific technical requirements:
Description of the glass substrate
-Material: SiO2-based glass
-Size: = 6inch ? or = 6 inch square
-Surface roughness (measured by AFM, 1µm x 1µm) : Ra= 0.18 nm (equal to RMS = 0.15 nm)
-Description of bump and divot:
Locally exists on substrate surface (density: 0.1~10/cm²)
Shape: shallow oval
Size:
Length: = 500 nm
Height or depth: = 10 nm
Final requirements
-Surface roughness and smoothing of local bump/divot: reduce the height/depth of the local bump/divot to = 1nm without increasing the surface roughness (Ra= 0.18 nm). (The length of the bump/divot after planarization is not of concern).
-Area of planarization: global planarization of whole substrate surface is preferred
However the client has technology for detecting local bump/divot on the substrate before planarization, so local planarization is also acceptable to smooth out the bump/divot locally
-When adapting filling and coating methods, the coating material must have the following properties:
Heat resistance: = 200°C
Chemical resistance (acid, alkali, organic solvents): excellent
Stress: = 200MPa
Coating thickness: = 20nm
Reflectance: 10 to 20% at 200 to 500 nm is preferred. (Note: reflectance of the glass substrate is 5%).
Requirements of the respondents:
-At this stage, respondents should be able to reduce the height/depth of local bump/divot to = 50% of that prior to planarization
-The technology should be applicable not only for glass substrates but for similar materials such as silicon wafers
-Respondents should specifically demonstrate the current technology level (papers, research announcements, etc.)
-Proposals should describe a specific development plan for achieving the final requirements within three years.
Požadavky na partnera:
Requested Cooperation: License Agreement, Joint further development
Responses from companies (large or small, startups, etc.), hospital or academic researchers, contract research institutes, pharmacologists, nutritionists, medicinal chemists, drug formulators, biochemists, physiologists, alternative or traditional medicine providers, etc., from around the world are all welcome.
The client will review submitted proposals and select multiple candidates for detailed investigation. The client will execute non-disclosure agreements (NDA) with selected respondents if needed, seek further information disclosure and discuss specific development targets or potential opportunities. The client will select the best candidate through evaluations of supporting information, samples, face to face meetings, etc.
The client will execute necessary agreements with the selected respondents and kick off the project to establish the technology (one to two years). Specifics of any collaboration will be determined through consultation with the concerned parties.
Note that this profile requires a convincing solution proposal. Please contact your local EEN to get the Response template and find more information on the specific process here: http://www.us-eu-match.com/index.cfm?action=processFlow
Responses from companies (large or small, startups, etc.), hospital or academic researchers, contract research institutes, pharmacologists, nutritionists, medicinal chemists, drug formulators, biochemists, physiologists, alternative or traditional medicine providers, etc., from around the world are all welcome.
The client will review submitted proposals and select multiple candidates for detailed investigation. The client will execute non-disclosure agreements (NDA) with selected respondents if needed, seek further information disclosure and discuss specific development targets or potential opportunities. The client will select the best candidate through evaluations of supporting information, samples, face to face meetings, etc.
The client will execute necessary agreements with the selected respondents and kick off the project to establish the technology (one to two years). Specifics of any collaboration will be determined through consultation with the concerned parties.
Note that this profile requires a convincing solution proposal. Please contact your local EEN to get the Response template and find more information on the specific process here: http://www.us-eu-match.com/index.cfm?action=processFlow
Obchodní firma/fyzická osoba:
Technologické inovační centrum s.r.o.
Sídlo/Místo podnikání:
Vavrečkova 5262
760 01 Zlín
760 01 Zlín
Kontaktní osoba:
Lenka Kostelníková
Email:
Telefon:
+420 739 570 792
